Fraunhofer Institute for Applied Solid State Physics IAFAs an FMD institute, Fraunhofer IAF is participating in the APECS pilot line with the development of chiplets for high-frequency applications. APECS is intended to strengthen the European semiconductor industry as an important component of the EU Chips Act. The internal kick-off of the sub-project took place at Fraunhofer IAF in Freiburg on January 31, 2025. Due to the comprehensive technological and infrastructural measures associated with APECS, the majority of the institute’s departments were represented.
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Kick-off of the APECS sub-project at Fraunhofer IAF
2/3/2025 / Development of chiplets for high-frequency applications begins
As part of the EU Chips Act, a European consortium is developing a pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) over the next 4.5 years. The new developments in the field of heterogeneous integration, in particular of chiplets, are intended to sustainably increase the competitiveness, innovative strength and resilience of the European semiconductor industry. APECS is being implemented by the Research Fab Microelectronics Germany (FMD).
Participants of the APECS kick-off meeting at Fraunhofer IAF
Chiplets for high-frequency applications
Fraunhofer IAF cooperates in the FMD and contributes the development of novel GaN-on-SiC and InGaAs-on-Si chiplets as well as microbump interposers to the APECS pilot line. These technologies are particularly suitable for high-frequency applications due to their outstanding values in key parameters such as noise, output power and efficiency and promise innovations in measurement technology, communication, radar technology and sensor technology.
Inter-institutional cooperation
On January 31, 2025, the internal kick-off meeting for the APECS sub-project took place at Fraunhofer IAF in Freiburg. Representatives of all organizational units of the institute involved in APECS including Epitaxy, Technology and Microelectronics as well as Administration and Technical Services met to coordinate the complex project plan. Dr. Andreas Grimm took part in the kick-off on behalf of FMD.
Systems and processes for 6'' wafers
To ensure easy transfer to industry, the development and production of the chiplets and interposers at Fraunhofer IAF will take place on 6'' wafers. New equipment for epitaxy, process technology and metrology will therefore be procured for the institute’s clean room and put into operation by the end of 2027. In addition, existing processes for chiplet and interposer production will be adapted.
About APECS
The APECS pilot line is an important component of the EU Chips Act to drive chiplet innovation and increase research and manufacturing capacity for semiconductors in Europe. The institutes cooperating in the FMD are working closely with other European partners to set up the pilot line and are thus making a significant contribution to strengthening Europe’s technological resilience and thus also increasing global competitiveness in the semiconductor industry. APECS is co-funded by Chips Joint Undertaking and by national funding from Austria, Belgium, Finland, France, Germany, Greece, Portugal and Spain as part of the Chips for Europe initiative. The total funding for the APECS pilot line amounts to EUR 730 million over 4.5 years.
Funding
APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.
